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1

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Piotrowska, Kamila, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Année:

2017

Langue:

english

Fichier:

PDF, 1.82 MB

english, 2017

2

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila, Li, Feng, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Année:

2019

Fichier:

PDF, 4.09 MB

2019

3

Relative effect of solder flux chemistry on the humidity related failures in electronics

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Année:

2015

Langue:

english

Fichier:

PDF, 3.03 MB

english, 2015

4

Effect of pulsed voltage on electrochemical migration of tin in electronics

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 2.27 MB

english, 2015

5

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Conseil-Gudla, Hélène, Gudla, Visweswara C., Borgaonkar, Shruti, Jellesen, Morten S., Ambat, Rajan

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2017

Langue:

english

Fichier:

PDF, 4.04 MB

english, 2017

6

Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

Conseil-Gudla, H., Staliulionis, Z., Mohanty, S., Jellesen, M.S., Hattel, J.H., Ambat, R.

Journal:

Microelectronics Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 2.33 MB

english, 2018

7

Effect of hydrogen in aluminium and aluminium alloys: A review

Rajan Ambat, E S Dwarakadasa

Journal:

Bulletin of Materials Science

Année:

1996

Langue:

english

Fichier:

PDF, 746 KB

english, 1996

8

Contamination profile on typical printed circuit board assemblies vs soldering process

Conseil, Helene, Stendahl Jellesen, Morten, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Année:

2014

Langue:

english

Fichier:

PDF, 570 KB

english, 2014

9

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla, H., Staliulionis, Z., Jellesen, M. S., Jabbari, M., Hattel, J. H., Ambat, R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2017

Langue:

english

Fichier:

PDF, 2.60 MB

english, 2017

10

Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability

Conseil, Helene, Gudla, Visweswara Chakravarthy, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2016

Langue:

english

Fichier:

PDF, 3.06 MB

english, 2016

11

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Semi-empirical prediction of moisture build-up in an electronic enclosure using analysis of variance (ANOVA)

Nasirabadi, Parizad Shojaee, Conseil-Gudla, Helene, Mohanty, Sankhya, Jabbari, Masoud, Ambat, Rajan, Hattel, Jesper H.

Année:

2016

Langue:

english

Fichier:

PDF, 981 KB

english, 2016

12

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Microelectronics Reliability

Année:

2017

Langue:

english

Fichier:

PDF, 3.78 MB

english, 2017

13

Dry and wet ozonation of denim: degradation products, reaction mechanism, toxicity and cytotoxicity assessment

Ben Hamida, Sarra, Iftekhar, Sidra, Ambat, Indu, Srivastava, Varsha, Sillanpää, Mika, Amri, Zahra, Ladhari, Neji

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 802 KB

english, 2018

14

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Staliulionis, Ž., Conseil-Gudla, H., Mohanty, S., Jabbari, M., Ambat, R., Hattel, J. H.

Journal:

Journal of Electronic Packaging

Année:

2018

Langue:

english

Fichier:

PDF, 1.51 MB

english, 2018

15

[IEEE 2018 1st IEEE International Conference on Knowledge Innovation and Invention (ICKII) - Jeju Island, Korea (South) (2018.7.23-2018.7.27)] 2018 1st IEEE International Conference on Knowledge Innovation and Invention (ICKII) - Data Mining of Students' Response on the University Services using Chi-square Automatic Interaction Detector (CHAID) Algorithm

Rosas, Maryli F., Ambat, Shaneth C., Ballera, Melvin A.

Année:

2018

Fichier:

PDF, 483 KB

2018

16

Corrosion failure due to flux residues in an electronic add-on device

Morten S. Jellesen, Daniel Minzari, Umadevi Rathinavelu, Per Møller, Rajan Ambat

Journal:

Engineering Failure Analysis

Année:

2010

Langue:

english

Fichier:

PDF, 1.27 MB

english, 2010

17

Effect of iron-containing intermetallic particles on the corrosion behaviour of aluminium

Rajan Ambat, Alison J. Davenport, Geoff M. Scamans, Andreas Afseth

Journal:

Corrosion Science

Année:

2006

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2006

18

On the electrochemical migration mechanism of tin in electronics

Daniel Minzari, Morten S. Jellesen, Per Møller, Rajan Ambat

Journal:

Corrosion Science

Année:

2011

Langue:

english

Fichier:

PDF, 2.18 MB

english, 2011

19

Novel electrochemical approach to study corrosion mechanism of Al–Au wire–bond pad interconnections

Elisseeva, O. V., Bruhn, A., Cerezo, J., Mavinkurve, A., Rongen, R. T. H., O’Halloran, G. M., Ambat, R., Terryn, H., Mol, J. M. C.

Journal:

Corrosion Engineering Science and Technology

Année:

2013

Langue:

english

Fichier:

PDF, 663 KB

english, 2013

20

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Experimental study of water absorption of electronic components and internal local temperature and humidity into electronic enclosure

Conseil, Helene, Jellesen, Morten S., Ambat, Rajan

Année:

2014

Langue:

english

Fichier:

PDF, 507 KB

english, 2014

21

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Conseil, Hélène, Verdingovas, Vadimas, Jellesen, Morten S., Ambat, Rajan

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2016

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2016

22

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil, Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Microelectronics Reliability

Année:

2019

Fichier:

PDF, 488 KB

2019

23

An appreciation of TATVA

Ambat Vijayakumar

Journal:

Année:

2005

Langue:

english

Fichier:

PDF, 219 KB

english, 2005

24

A corrosion investigation of solder candidates for high-temperature applications

Vivek Chidambaram, John Hald, Rajan Ambat, Jesper Hattel

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Année:

2009

Langue:

english

Fichier:

PDF, 551 KB

english, 2009

25

Changes in the chemistry of shallow groundwater related to the 2008 injection of CO2at the ZERT field site, Bozeman, Montana

Yousif K. Kharaka, James J. Thordsen, Evangelos Kakouros, Gil Ambats, William N. Herkelrath, Sarah R. Beers, Jens T. Birkholzer, John A. Apps, Nicholas F. Spycher, Liange Zheng, Robert C. Trautz, Henr

Journal:

Environmental Earth Sciences

Année:

2010

Langue:

english

Fichier:

PDF, 707 KB

english, 2010

26

Electrochemical depth profiling of multilayer metallic structures: An aluminum brazing sheet

F. Norouzi Afshar, R. Ambat, C. Kwakernaak, J.H.W. de Wit, J.M.C. Mol, H. Terryn

Journal:

Electrochimica Acta

Année:

2012

Langue:

english

Fichier:

PDF, 2.04 MB

english, 2012

27

Effect of No-Clean Flux Residues on the Performance of Acrylic Conformal Coating in Aggressive Environments

Rathinavelu, U., Jellesen, M.S., Moller, P., Ambat, R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 1.73 MB

english, 2012

28

[IEEE 2009 Annual Reliability and Maintainability Symposium (RAMS) - Fort Worth, TX, USA (2009.01.26-2009.01.29)] 2009 Annual Reliability and Maintainability Symposium - Effect of solder flux residues on corrosion of electronics

Hansen, Kirsten Stentoft, Jellesen, Morten S., Moller, Per, Westermann, Peter Jacob Schwencke, Ambat, Rajan

Année:

2009

Langue:

english

Fichier:

PDF, 700 KB

english, 2009

29

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari, D., Jellesen, M.S., Moller, P., Wahlberg, P., Ambat, R.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2009

Langue:

english

Fichier:

PDF, 1.56 MB

english, 2009

30

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 2.11 MB

english, 2014

31

[IEEE 2009 International Symposium on Ocean Electronics (SYMPOL 2009) - Cochin, India (2009.11.18-2009.11.20)] 2009 International Symposium on Ocean Electronics (SYMPOL 2009) - Design and implementation of a novel real time target tracking scheme for passive SONARs using MVDR beam forming and Kalman filtering

Joseph, V. Ojish, Ambat, Sooraj K., George, Jomon

Année:

2009

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2009

32

Electrochemical Behavior of the Active Surface Layer on Rolled Aluminum Alloy Sheet

Ambat, Rajan, Davenport, Alison J., Afseth, Andreas, Scamans, Geoff

Journal:

Journal of The Electrochemical Society

Année:

2004

Langue:

english

Fichier:

PDF, 1013 KB

english, 2004

33

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 5.18 MB

english, 2015

34

Performance Comparison of Steam-Based and Chromate Conversion Coatings on Aluminum Alloy 6060

Din, Rameez Ud, Jellesen, Morten S., Ambat, Rajan

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 16.51 MB

english, 2015

35

Index of Suspicion in the Nursery * Case 1: Seizures in a Preterm Infant * Case 2: Prolonged Jaundice in a Term Neonate

Sims, M. E., Ambat, M. T. C., Betty, I.

Journal:

Année:

2010

Langue:

english

Fichier:

PDF, 977 KB

english, 2010

36

[IEEE 2016 Third International Conference on Digital Information Processing, Data Mining, and Wireless Communications (DIPDMWC) - Moscow, Russia (2016.7.6-2016.7.8)] 2016 Third International Conference on Digital Information Processing, Data Mining, and Wireless Communications (DIPDMWC) - Predicting IT employability using data mining techniques

Piad, Keno C., Dumlao, Menchita, Ballera, Melvin A., Ambat, Shaneth C.

Année:

2016

Langue:

english

Fichier:

PDF, 793 KB

english, 2016

37

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil-Gudla, Hélène, Jellesen, Morten S., Ambat, Rajan

Journal:

Journal of Electronic Materials

Année:

2017

Langue:

english

Fichier:

PDF, 2.17 MB

english, 2017

38

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity

Mohanty, Sankhya, Staliulionis, Zygimantas, Nasirabadi, Parizad S., Ambat, Rajan, Hattel, Jesper H.

Année:

2016

Langue:

english

Fichier:

PDF, 373 KB

english, 2016

39

Corrosion failure analysis of hearing aid battery-spring contacts

Gudla, Visweswara Chakravarthy, Ambat, Rajan

Journal:

Engineering Failure Analysis

Année:

2017

Langue:

english

Fichier:

PDF, 2.88 MB

english, 2017

40

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila, Din, Rameez Ud, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 2.25 MB

english, 2018

41

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of interior geometry on local climate inside an electronic device enclosure

Joshy, Salil, Jellesen, Morten, Ambat, Rajan

Année:

2017

Fichier:

PDF, 349 KB

2017

42

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo, L., Verdingovas, V., Ferrero, L., Bolzacchini, E., Ambat, R.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2017

Langue:

english

Fichier:

PDF, 1.60 MB

english, 2017

43

Recent advancement in biodiesel production methodologies using various feedstock: A review

Ambat, Indu, Srivastava, Varsha, Sillanpää, Mika

Journal:

Renewable and Sustainable Energy Reviews

Année:

2018

Langue:

english

Fichier:

PDF, 688 KB

english, 2018

44

Transformation of iron containing constituent intermetallic particles during hydrothermal treatment

Borgaonkar, Shruti, Din, Rameez Ud, Kasama, Takeshi, Ambat, Rajan

Journal:

Thin Solid Films

Année:

2018

Langue:

english

Fichier:

PDF, 2.49 MB

english, 2018

45

[IEEE 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oulu (2018.6.12-2018.6.14)] 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, Kamila, Jellesen, Morten S., Ambat, Rajan

Année:

2018

Langue:

english

Fichier:

PDF, 392 KB

english, 2018

46

Application potassium ion impregnated titanium dioxide as nanocatalyst for transesterification of linseed oil.

Ambat, Indu, Srivastava, Varsha, Haapaniemi, Esa, Sillanpää, Mika

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 999 KB

english, 2018

47

[Lecture Notes in Computer Science] Algorithms and Discrete Applied Mathematics Volume 11394 (5th International Conference, CALDAM 2019, Kharagpur, India, February 14-16, 2019, Proceedings) || The Relative Signed Clique Number of Planar Graphs is 8

Pal, Sudebkumar Prasant, Vijayakumar, Ambat

Année:

2019

Langue:

english

Fichier:

PDF, 256 KB

english, 2019

48

Characterization of blisters on powder coated aluminium AA5006 architectural profiles

Zaffaroni, Giorgio Giovanni Battista, Gudla, Visweswara Chakravarthy, Ud Din, Rameez, Ambat, Rajan

Journal:

Engineering Failure Analysis

Année:

2019

Langue:

english

Fichier:

PDF, 4.04 MB

english, 2019

49

[IEEE 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Kauai, HI, USA (2019.2.11-2019.2.14)] 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila, Lagana, Simone, Jellesen, Morten S., Ambat, Rajan

Année:

2019

Langue:

english

Fichier:

PDF, 34 KB

english, 2019

50

[IEEE TENCON 2018 - 2018 IEEE Region 10 Conference - Jeju, Korea (South) (2018.10.28-2018.10.31)] TENCON 2018 - 2018 IEEE Region 10 Conference - Retention and Acquisition of New Vocabularies using Applying Review Value Calculation for English as Secondary Language

Mustafa, Burhan, Ballera, Melvin A., Ambat, Shaneth C.

Année:

2018

Langue:

english

Fichier:

PDF, 762 KB

english, 2018